The American wafer fabrication tools producer Lam Analysis has accomplished the acquisition of Austria based mostly SEMSYSCO, a worldwide supplier of moist processing semiconductor tools, for an undisclosed quantity. With this acquisition, Lam provides capabilities in superior packaging, splendid for modern logic chips and chiplet-based options for high-performance computing (HPC), synthetic intelligence (AI) and different data-intensive purposes to its portfolio.
“The strategic acquisition of SEMSYSCO furthers our dedication to assist chipmakers tackle their rising know-how challenges, including deep capabilities in superior substrates and packaging processes,” mentioned Tim Archer, president and chief govt officer at Lam Analysis. “With progressive choices and modern analysis and growth in packaging, Lam is well-positioned to assist our prospects as they scale to future chiplet-based applied sciences,” he added.
The acquisition of SEMSYSCO broadens Lam’s packaging choices, bringing a portfolio of progressive cleansing and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration. This contains assist of fan-out panel-level packaging, a game-changing course of wherein chips or chiplets are lower from a big, rectangular substrate sheet a number of instances the dimensions of a standard silicon wafer. This method allows chipmakers to considerably improve yield and scale back waste.
“Packaging performs an necessary position in extending Moore’s Regulation and enabling future management merchandise with greater ranges of system in bundle integration. New substrate-based panel-level approaches are very important to cost-effectively realizing the high-performance chiplet-based options wanted for the digital world,” mentioned Keyvan Esfarjani, chief world operations officer at Intel Company. “We’re happy to increase our deep, long-standing relationship with Lam to incorporate superior cleansing and plating processes within the new panel kind issue.”
With the acquisition of SEMSYSCO, Lam additionally positive aspects a state-of-the-art R&D facility in Austria centered on next-generation substrates and heterogeneous packaging, broadening the corporate’s sturdy growth capabilities in Europe and including a sixth lab in Lam’s world community. As well as, it brings to Lam new and expanded relationships with chipmakers and fabless prospects.
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